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  • Electronic-Resin-Image

    Exhibits good impact resistance and improved wear resistance. Meets Mil Spec. MIL-R-22628.

  • Electronic-Resin-Image

    This system has superior adhesive properties on all metals, rubber and hard plastics (non-polyethylene) and is sandable in 10 to 15 minutes. Used in automotive repairs and all plastic parts repairs.

  • Electronic-Resin-Image

    A non-sag adhesive with superior bonding to all substrates including SMC and stainless steel.

  • Electronic-Resin-Image

    This system has a rigid cure with excellent adhesion and chemical resistance. It exhibits excellent thermal shock and impact resistance.

  • Electronic-Resin-Image

    A general purpose, 5 minute quick setting epoxy for adhesive and patching applications.

  • Electronic-Resin-Image

    A general purpose, 45 seconds quick setting epoxy for adhesive and patching applications.

  • Electronic-Resin-Image

    A high impact, vibration resistant, flexible adhesive for metals, plastics, wood and ceramics.

  • Electronic-Resin-Image

    Good adhesion to metals, plastics and ceramics. Meets requirements of FDA under 21 CFR 175.300 and Mil Spec. MIL-A-81236.

  • Electronic-Resin-Image

    This is a rubber based epoxy system that exhibits good thermal shock and excellent impact resistance.

  • Electronic-Resin-Image

    A high impact, vibration resistant, flexible adhesive for metals, plastics, wood and ceramics.

  • Electronic-Resin-Image

    This is an unfilled epoxy system with a room temperature cure with excellent adhesion to metals, plastics and ceramics.

  • Electronic-Resin-Image

    A durable compound for repair to aluminum castings and tooling applications. When cured this system can be drilled or tapped using conventional metalworking tools.

  • Electronic-Resin-Image

    An aluminum-filled pourable epoxy system used for making molds, patterns and holding fixtures. This system permits reproduction of delicate or intricate parts for accurate reproduction of details.

  • Electronic-Resin-Image

    This system is a non-sag compound, with superior compressive and adhesive strength. It adheres to most metals and various substrates. Meets Mil Spec. MIL-PRF-24176 Type I and Type II.

  • Electronic-Resin-Image

    A durable compound that can be drilled, tapped, machined or painted when cured. Bonds to steel, aluminum, brass, wood, glass, ceramic and iron. Ideal for patching, repairing and rebuilding steel equipment. Meets MIL Spec. AA-56015A.

  • Electronic-Resin-Image

    A steel-filled pourable epoxy system for maintenance, repair and tooling applications. This system can be cast over models for accurate detail reproduction. When cured, this system can be drilled, tapped, machined or painted.

  • Electronic-Resin-Image

    Used to mold, fill and bond practically anything. May be drilled, filed and sanded after one hour. Adheres to aluminum, iron, steel, wood, glass, masonry, ceramics and many plastics. Meets MIL Spec. S-8802 Class B.

  • Electronic-Resin-Image

    An epoxy compound for permanent wood repairs such as filling nail holes, replacing and reshaping wood parts and for general restoration. Its unique properties include its ability to be molded to any shape and rapid cure.

  • Electronic-Resin-Image

    Exhibits excellent adhesive properties on metals and is resistant to most chemicals and moisture with good thermal shock resistance. Meets Mil Spec. MMM-A-187B.

  • Electronic-Resin-Image

    An adhesive and sealing compound for all metals. Meets Mil Spec. MMM-A-1754.

  • Electronic-Resin-Image

    Excellent all purpose repair epoxy that can be handled in 5 minutes and cures to a full bond strength in one hour. Excellent adhesion to wood, ceramics, metals, fiberglass, glass and china.

  • Electronic-Resin-Image

    This is a quick set adhesive with superior adhesive properties on all metals, rubber and hard plastics (non-polyethylene) and can be handled in 10 to 15 minutes.

  • Electronic-Resin-Image

    Used for adhesive and electronic applications such as wire staking, bonding components, strain gauges, fiber optics and ferrite cores.

  • Electronic-Resin-Image

    Used for electronic applications such as wire staking, bonding components, strain gauges, fiber optics and ferrite cores.

  • Electronic-Resin-Image

    Used for glass reinforced coating on metals for protection against the corrosive effects of salt water. Meets Mil Spec. R-23461A.

  • Electronic-Resin-Image

    Widely used in the automotive and aerospace industries as impreg glue.

  • Electronic-Resin-Image

    A toughened medium viscosity adhesive that forms a tough bond line with high peel resistance and high shear strength.

  • Electronic-Resin-Image

    A unfilled epoxy for those hard to bond substrates like PTFE, nylon, stainless steel and other difficult substrates.

  • Electronic-Resin-Image

    A unfilled epoxy for those hard to bond substrates like PTFE, nylon, stainless steel and other difficult substrates.

  • Electronic-Resin-Image

    A non-sag paste version of above.

  • Electronic-Resin-Image

    An epoxy compound for permanent wood repairs such as filling nail holes, replacing and reshaping wood parts and for general restoration. Its unique properties include its ability to be molded to any shape and rapid cure. Meets Mil Spec. S-8802 Class B.

  • Electronic-Resin-Image