Exit
  • Electronic-Resin-Image

    Optik-Bond Adhesives are ideal for potting and sealing optical connectors, fibers, lenses, and all other optical components.

  • Electronic-Resin-Image

    COB Systems are a series of single component, high performance, flow control and encapsulating applications for the semiconductor industry.

  • Electronic-Resin-Image

    Circuit Bond Adhesives are a series of lead-free, low temperature cure, high speed dispensed surface mount adhesives.