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Formulating Epoxy Systems for more than 40 years
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Epoxy Adhesives & Epoxy Resin Systems > Electronic Assembly Products > SMT and COB Specialty Adhesives > Item # 1  
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Item # 1, COB Specialty Components



COB Systems are a series of single component, high performance, flow control and encapsulating applications for the semiconductor industry.





Specification Chart
COB SYSTEMSVISCOSITY
CPS @ 72 ºF
GLASS
TRANSITION
(TG) ºC
CTE
PPM/ °C
HALOGEN
FREE
CURE
SCHEDULE
HOURS
@ 125 °C
VOLUME
RESISTIVITY
PER ASTM
D257
SURFACE
RESISTIVITY
PER ASTM
D257
DISSIPATION
FACTOR
PER ASTM
D150
DIELECTRIC
CONSTANT
PER ASTM
D149 (1 kHz)
Epoxy Dam ControlPaste18039.0Yes62.1 x 10142.09 x 10140.00924.94
Epoxy Fill System80,00017539.5Yes62.6 x 10142.89 x 10140.00815.02
Low Profile Glop Top195,00015528Yes21.79 x 10142.18 x 10140.00874.97
High Profile Glop Top940,00017739.1Yes21.9 x 10142.39 x 10140.00874.97
Low Chlorine Encapsulant63,00015028.0Yes31.9 x 10142.39 x 10140.00874.97