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Epoxy Adhesives & Epoxy Resin Systems
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Electronic Assembly Products
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SMT and COB Specialty Adhesives
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Item # 1
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Item # 1, COB Specialty Components
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COB Systems are a series of single component, high performance, flow control and encapsulating applications for the semiconductor industry.
Specification Chart
COB SYSTEMS
VISCOSITY
CPS @ 72 ºF
GLASS
TRANSITION
(TG) ºC
CTE
PPM/ °C
HALOGEN
FREE
CURE
SCHEDULE
HOURS
@ 125 °C
VOLUME
RESISTIVITY
PER ASTM
D257
SURFACE
RESISTIVITY
PER ASTM
D257
DISSIPATION
FACTOR
PER ASTM
D150
DIELECTRIC
CONSTANT
PER ASTM
D149 (1 kHz)
Epoxy Dam Control
Paste
180
39.0
Yes
6
2.1 x 10
14
2.09 x 10
14
0.0092
4.94
Epoxy Fill System
80,000
175
39.5
Yes
6
2.6 x 10
14
2.89 x 10
14
0.0081
5.02
Low Profile Glop Top
195,000
155
28
Yes
2
1.79 x 10
14
2.18 x 10
14
0.0087
4.97
High Profile Glop Top
940,000
177
39.1
Yes
2
1.9 x 10
14
2.39 x 10
14
0.0087
4.97
Low Chlorine Encapsulant
63,000
150
28.0
Yes
3
1.9 x 10
14
2.39 x 10
14
0.0087
4.97
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Formulating Epoxy Systems for more than 40 years
Formulating Epoxy Systems for more than 40 years